Prodction
Technology Levels | |
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Standard | Current standard capability |
Advanced | Current capability with a modest premium |
Emerging | Have experience and can fabricate on request --please contact Sunshine Engineering to discuss |
Future | Process development project based on customer request and joint collaboration |
RF Micro Wave Technology Roadmap(1) | |||||
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inch [mm] | Standard | Advanced | Emerging | Future | |
inch [mm] | 2021 | 2021 | 2021-2022 | 2023 | |
Key Attributes | Layer Count | Up 8L | 10L to 12L | 14L to 16L | 16+L |
Min/Max Thickness | .012” [.30]/.075" [1.9] | .008" [.20]/.125" [3.2] | .008” [.20]/.220" [5.6] | TBD/.250" [6.4] | |
Largest Panel | 18x24[457x610] | 21x24 [533 x 610] | 24x30 [610 x 762] | TBD | |
Minimum Line & Space (Copper Wts*) |
O/L Line Width/Space | .003.5" [.089] H | .002.5" [.064] Q | <.002" [.05] 5um | .0015" [.038] 5um |
I/L Line Width/Space | .003.5" [.089] 1 | .002.5" [.064] T | <.002" [.05] 5um | .0015 [.0538] 5um | |
Tolerance | ±.0005" [.013] | ±.0003" [.008] | ±.0002" [.005] | ±.0002" [.005] | |
Drilled Vias Size | Drill Size | .008" [.20] | .006" [.15] | .005" [.255] | .004" [.10] |
Pad Diameter | +.008" [.20] | +.008" [.20] | +.006" [.15] | +.005" [.125] | |
Aspect Ratio | 10:1 | 12:1 | 15:1 | 20:1 |
RF Micro Wave Technology Roadmap(2) | |||||
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inch [mm] | Standard | Advanced | Emerging | Future | |
inch [mm] | 2021 | 2021 | 2021-2022 | 2023 | |
Via Structures | Microvia layers | 1+N+1 | 2+N+2 | 3+N+3 | ELIC/Anylayer |
Buried Subs | Yes | Yes | Yes | Yes | |
Stacked Microvia | Stacked on Sub | Yes | Yes | Yes | |
Microvias Line & Space (Copper Wts*) |
Min Via Size | .004" [.10] | .003" [.076] | .002" [.05] | .002" [.05] |
Pad Diameter | +.006" [.15] | +.006" [.15] | +.004" [.10] | +.004" [.10] | |
Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | 1:1 | |
Conductive & NonConductive Via Fill After Cu Plate | Min Hole Size | .008" [.20] | .008" [.20] | .006" [.15] | .006" [.15] |
Aspect Ratio | 10:1 | 15:1 | 20:1 | 25:1 |
RF Micro Wave Technology Roadmap(3) | |||||
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inch [mm] | Standard | Advanced | Emerging | Future | |
inch [mm] | 2021 | 2021 | 2021-2022 | 2023 | |
Soldermask | Registration | ±.002" [.05]/td> | ±.0015" [.038] | ±.001" [.025] | Tangency |
Min Opening | .004" [.10] | .003" [.076] | .003" [.076] | SMDP | |
Dam Min Width | .003" [.076] | .002" [.05] | .002" [.05] | Eng Eval | |
Surface Finishes | ENIG, OSP | ENEPIG | Thick Gold Multiple Finishes | TBD | |
Im Sn, | Wire Bondable Gold | ||||
LF HASL | Multiple Finishes | ||||
Im Ag | |||||
Conductive & NonConductive Via Fill After Cu Plate | Min Hole Size | .008" [.20] | .008" [.20] | .006" [.15] | .006" [.15] |
Aspect Ratio | 10:1 | 15:1 | 20:1 | 25:1 |
RF Micro Wave Technology Roadmap(4) | |||||
---|---|---|---|---|---|
inch [mm] | Standard | Advanced | Emerging | Future | |
inch [mm] | 2021 | 2021 | 2021-2022 | 2023 | |
Controlled Impedance Tolerance | ± 10% | ± 8% | ± 5% | TBD | |
Drill to Copper | .008" | .006" [.15] | <.006" [.15] | .004" [.10] | |
Min Annular Ring Tangency | Drill+.008"[.20] | Drill+.006"[.15] | Drill+<.006"[.15] | Drill+.005"[.13] | |
Feature to PCB Edge | .020" [.50] | .015" [.38] | .010" [.25] | <.010" [.25] | |
Hole to PCB Edge | .020" [.50] | .015" [.38] | .010" [.25] | <.010" [.25] | |
Rout Tolerance | ±.008”/.004" [.20/.10] | ±.006“/.004”[.15/.10] | ±.002”/.002" [.05/.05] | <±.002” [.05] applications | |
Sequential Lamination | Yes | Yes | Yes | Yes | |
Back Drill | Yes | Yes | Yes | Yes | |
Back Drill Tolerance | ±.008" [.20] | ±.006" [.15] | <±.006" [.15] | Eng Eval | |
Technology Development |
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Chief Technology Officer David Aldape, 30+ years of advance technology experience, leads a dedicated team of R&D Engineers. |
Development projects for 2020 - 2022: |
High Aspect Ratio Copper Plating |
Increase Layer Count, Very Thin MLs/MV Technology |
Controlled impedance tolerance of ± 5% or less |
Advanced imaging and etching methods for ultra fine lines |
Advanced tooling systems for improving L2L registration |
Continual addition of new materials for HDI, High Speed Low Loss and High Speed Very Low Loss (5G materials**) |
ELIC (Every Layer Inner Connect)and Deep MVs |
Thermal Management Solutions: Copper Coin, Embedded Components PCBs and All in One Packages |
mSAP and SAP processing technology |
Reverse Pulse Plating
Improved Surface to Hole Throwing Power
Superior IST Performance
Decreased Cycle Time
High Reliability
• Automated Test Equipment (ATE) Technology
• Device Under Test (DUT) Technology/Burn in Board Technology
• High Layer Count Back Planes
Direct Imaging
Optical CCD Alignment accuracy +/- 7um
Fine Line Resolution <.002” Lines (50um)
Multi Wave Length for Solder Mask Exposure
SM Opening down to 80um
XACT Material Predation Software
Automate accurate manufacturing data with advanced predictive material scale factors
Helps control and analyze for improved registration capability.
Advanced M/L Tooling System
Direct Optical Registration System
Pinless lamination for M/L, Sequential Lam
Vision System CCD cameras
• Improved positioning repeatability +/- 17 microns
• Improved readability and statistical data collection
• Increased panel usage area compared to traditional lamination
UL Material Qualification Program
Continual Advancement in new materials
Isola: Tachyon 100G I-Tera®, Astra MT
Panasonic: Megtron 7N
EMC : EM 891/K
5G and RF/Micro wave materials
Direct Plate Chemistry
Eliminates ICDs
High Thermal Stability
Excellent for High Layer Count
Micro Via and Flex Technology
Deep Micro Via Technology
Provide additional routing density
Improved Impedance Performance
Solid Copper Plated Surface for BGAs
Improved Current Carrying Capacity
Every Layers Inner Connect
ELIC maximizes design freedom
Solid Copper provides better reliability
Superior Electrical characteristics
Solid Copper Plate Vias
Diameters .005-.012”
Fine Pitch Traces/Space
Thermal conductivity (385 W/mK)
Copper Coin PCBs
Improved Heat Distribution
Thermal Conductivity (385 W/mK)
Solid copper press fit into the board
Through Hole can be connected as well
Cavity and Special Dielectrics
Layer Count: 2 to 10 Layers
Material Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX, TLY)
Hybrid Option: RO4350B + FR4
Finishes: ENIG, Wire Bondable Gold, Flash Gold
Finishes: ENIG, Wire Bondable Gold, Flash Gold
Special Process: Cavities, Selective Plating and Etching
Applications: Radio Trans‐receivers, Antennas, Power Amplifiers